By James J. Licari
This publication is exclusive in its finished insurance of all facets of adhesive know-how for microelectronic units and packaging, from conception to bonding to check systems. as well as common functions, akin to dies, substrate, and lid and chip stack attachments, the publication contains new advancements in anisotropic, electrically conductive, and underfill adhesives. speedy curing tools reminiscent of UV, microwave, and moisture (which conform to present environmental and effort specifications) are coated. Over eighty tables and a hundred and twenty figures offer a wealth of information on homes, functionality, and reliability. additionally integrated are examples of commercially to be had adhesives, providers, and gear. every one bankruptcy offers entire references.
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Additional resources for Adhesives Technology for Electronic Applications: Materials, Processing, Reliability
Viscosity and contact angle are related; increasing the viscosity increases the contact angle, thus reducing wettability and flow. The amount and nature of the filler in adhesive formulations also affect viscosity and contact angle, the higher the filler concentration, the greater the viscosity. Of three underfill adhesives from Hysol: FP4454, FP4511, and FP4527, having contact angles of 5°–10°, 18°–20°, and 10°–15°, respectively; Hysol FP4511 with the highest filler content had the largest contact angle.
Soc. Hybrid Microelect. (1991) 17. Harper, C. , and Sampson, R. , McGraw-Hill (1993) 18. Lau, J. , Chip on Board, Kluwer Academic Publishers, Dordrecht (1994) 19. Wong, C. , Polymers for Electronic and Photonic Applications, Academic Press (1993) 20. , Engineering Surfaces in Ceramic Pin Grid Array Packaging to Inhibit Epoxy Bleeding, HewlettPackard J. (Aug. 1998) 21. , Chip-Scale Packaging Meets Future Design Needs, Solid State Technol. (Apr. 1996) 22. Bauer, C. , Let’s Talk Chip Scale, Circuits Assembly, IPC Supplement (Apr.
During this early period, polyurethanes were used where flexibility and vibration damping of large components were required.  They were studied for bonding electronic components and heat sinks to printed-wiring boards in the early 1960s. Both cyanoacrylates and anaerobic adhesives provided very rapid tacking and curing in the absence of air, but were soon abandoned for electronic applications because of their poor resistance to elevated temperature-humidity environments, especially where they had to meet military specifications.